Surface Mount Technology (SMT) packages include the leaded family packages (Quad Flat Pack (QFP) and Plastic Leaded Chip Carrier (PLCC)) and the Ball Grid Array (BGA) packages.
A Xilinx UART (Universal Asynchronous Receiver and Transmitter) to PCI (Peripheral Component Interconnect bus) bridging solution is ideal to integrate the emerging Bluetooth communications standard i
Support for Triple DES Encryption begins in ISE/Foundation software version 4.1i. The software patch available at the following link is needed with software version 4.1i.
These packages offer small size and high logic density for both high performance and low power applications. The two CSP discussed in this white paper are the CP56 and CP132 packages.
HSTL is a technology-independent interface standard for digital integrated circuits. It is a JEDEC standard developed for voltage scalable and technology independent I/O structures.