Submitted by fpgawhitepaper on September 13, 2008 - 10:47pm
Whitepaper By:
Xilinx
Surface Mount Technology (SMT) packages include the leaded family packages (Quad Flat Pack (QFP) and Plastic Leaded Chip Carrier (PLCC)) and the Ball Grid Array (BGA) packages.
Submitted by fpgawhitepaper on September 13, 2008 - 10:46pm
Whitepaper By:
Xilinx
A Xilinx UART (Universal Asynchronous Receiver and Transmitter) to PCI (Peripheral Component Interconnect bus) bridging solution is ideal to integrate the emerging Bluetooth communications standard i
Submitted by fpgawhitepaper on September 13, 2008 - 10:30pm
Whitepaper By:
Xilinx
Support for Triple DES Encryption begins in ISE/Foundation software version 4.1i. The software patch available at the following link is needed with software version 4.1i.
Submitted by fpgawhitepaper on September 13, 2008 - 10:30pm
Whitepaper By:
Xilinx
These packages offer small size and high logic density for both high performance and low power applications. The two CSP discussed in this white paper are the CP56 and CP132 packages.
Submitted by fpgawhitepaper on September 13, 2008 - 10:29pm
Whitepaper By:
Xilinx
HSTL is a technology-independent interface standard for digital integrated circuits. It is a JEDEC standard developed for voltage scalable and technology independent I/O structures.