ST leads across all mobile operating systems

Executive conference examines MEMS’ connection to European advancements in consumer, automotive, energy, medical

MEMS Industry Group’s 2013 CES MEMS TechZone Shows Consumers What’s Next

PITTSBURGH—December 18, 2012—MEMS Industry Group (MIG), a global industry organization with close to 150 member-companies and partners, today announced a line-up of suppliers, partners and end-user companies, all participating in MEMS TechZone, its show-floor experience at the 2013 International CES.

Leuven (Belgium) – October 10, 2011 – Imec realized an integrated poly-SiGe-based piezoresistive pressure sensor directly fabricated above 0.13 µm copper (Cu) -backend CMOS technology. This represents not only the first integrated poly-SiGe pressure sensor directly fabricated above its readout circuit, but also the first time that a poly-SiGe MEMS device is processed on top of Cu-backend CMOS.