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Imec First to Introduce Hyperpectral CMOS Camera for Snapshot and Video

Ideal for next-generation industrial inspection, medical diagnosis and security applications, CMOS imagers with integrated hyperspectral filters enable compact fast hyperspectral imaging

Imec and Qualcomm Extend R&D Collaboration to Advance CMOS Technologies for Next-Generation Products

Leuven (Belgium) and San Diego (USA) 28 January, 2013 – Nanoelectronics research centre imec and Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), announced today an extended collaboration agreement to accelerate scaling technologies for logic and memory devices.

PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy

Scanning acoustic microscopy (SAM) for non-destructive void inspection after wafer bonding improves wafer thinning performance and tool stability and can also be applied to detect voids in TSVs during processing

Kuwait University and imec to Collaborate on Advanced Silicon Solar Cell Technology

Agreement paves the way for long-term commitment on strengthening and advancing solar cell technology in Kuwait

Imec and Altera Broaden Strategic Collaboration

Leuven (Belgium) – December 18, 2012 - Imec and Altera Corporation (Nasdaq: ALTR) announced today a broadening of their strategic research collaboration in the framework of imec’s INSITE program.

Imec Shows Path Toward Non-Si Devices at IEDM 2012

IEDM2012, San Francisco, USA - December 12, 2012 - At this week’s IEEE International Electron Devices Meeting (IEDM 2012), imec addressed key challenges of scaling beyond silicon-channel finFETs. Imec showed that channel mobility can be boosted by growing non-Si channels on a strain relaxed buffer (SRB), and demonstrated excellent scalability potential of the technology.

Imec and Synopsys Expand FinFET Collaboration to 10 Nanometer Geometry

Collaboration Enhances Synopsys’ Sentaurus TCAD Models for Next-generation FinFET Technology

Imec and Holst Centre to Present Research Breakthroughs at the International Solid-State Circuits Conference

Leuven (Belgium) – November 26, 2012 – Imec and Holst Centre announced today that they will present nine papers at the 60th International Solid-State Circuits Conference (ISSCC), February 20-24, 2013 in San Francisco. ISSCC is the foremost global forum on advancements in solid-state circuits and systems on a chip (SOCs).

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