heterogeneous 3d ics

Xilinx and TSMC ship first heterogeneous 3d ics

Claiming an industry first, Xilinx and TSMC have commenced volume production of the Virtex-7 HT family of heterogeneous 3d ics.

The all programmable, 28nm devices were developed using TSMC's Chip on Wafer on Substrate (CoWoS) 3d ic process.

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