Analog

Design Conference 2013 - Irvine, CA

Design Conference 2013 - Irvine, CA
When: 
Dec 4 2013 - 9:00am

Analog Devices, in partnership with Xilinx and MathWorks, presents a series of free one-day technical training events that bring together leading industry experts to introduce complete signal chain and system-ready solutions for complex design challenges.

Conference highlights include:

Technical sessions running throughout the day, delivered by the experts

MILCOM 2013 - San Diego, CA

MILCOM 2013 - San Diego, CA
When: 
Nov 18 2013 - 9:00am

Meet with Xilinx and Analog Devices to see a demonstration and learn how the new Zynq-7000 AP SoC / AD9361 Software-Defined Radio Systems Development Kit enables increased design productivity and faster time to prototype for next generation MILCOM SDR systems.

Xilinx will be at the Analog Devices booth to offer assistance to visitors seeking answers to questions on:

IC Layout Design and Verification - San Jose, CA

IC Layout Design and Verification - San Jose, CA
When: 
Oct 30 2013 - 9:00am

This is one of the most comprehensive IC Layout training programs in the industry. It covers semiconductor process technologies from 0.35um BCD down to 14nm CMOS and explores Analog, Mixed-Signal and RF layout skills. Instructors are seasoned engineers with deep understanding of physical design, class assignments and practice examples are realistic and are taken from actual design projects.

Taming the analog beast – Using X-FAB’s PDKs and the right design methodology (webinar)

Taming the analog beast
When: 
Oct 9 2013 - 9:00am

Taming the analog beast – Using X-FAB’s PDKs and the right design methodology (webinar)

Who:

X-FAB Silicon Foundries, the leading pure-play foundry for analog/mixed-signal semiconductor applications

What:

ams invests over €25m to create dedicated in-house production capacity for analog 3D ICs

Soaring demand for stacked-die devices shows value of ams’ patented TSV fabrication technology

Unterpremstaetten, Austria (3 September, 2013), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensor solutions, today announced that it has invested over €25m to create dedicated 3D IC production capacity at its wafer fabrication plant near Graz, Austria.

Cirrus Logic Ultra-Low Power, 4-Channel Microphone A/D Converter Enhances Performance for Voice Applications

In Volume Production Today, CS53L30 Features Four Analog or Digital Mic Inputs For High-Precision Voice Processing

AUSTIN, Texas – July 24, 2013 – Focusing on enabling enhanced voice processing features in smartphones, tablets and other consumer electronics applications, Cirrus Logic, Inc. (Nasdaq: CRUS) has introduced the ultra-low power CS53L30 analog-to-digital (A/D) converter.

New high-speed differential amplifiers deliver best power-to-performance ratio with 80-percent power savings

TI’s new devices provide low power consumption, noise and distortion

TSMC Expands Collaboration with Cadence on Virtuoso Custom Design Platform

HIGHLIGHTS:

• TSMC to create and deliver native SKILL®-based PDKs in support of the Cadence® Virtuoso® platform to provide customers with the best user experience and highest level of accuracy
• World’s leading foundry deploys Virtuoso platform for custom design needs in advanced nodes, including 16-nanometer FinFET designs

X-FAB Introduces New Analog/Mixed-Signal Reference Kit for Rapid Adoption of Advanced Cadence Design Flows

Gets closer to first-time-right analog design by integrating advanced EDA features in design flow to increase design productivity, reduce time to market and design costs

TI makes analog easier with new library of precision designs

Library of Reference, Verified and CerTIfied Designs help engineers quickly evaluate and customize their systems

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