Eeek alors! The net is buzzing with the news that the folks from Altera and TSMC have just announced their joint development of what they describe as “The world’s first heterogeneous 3D IC test vehicle using TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) integration process” (see also Dylan McGrath’s column TSMC, Altera team on 3-D IC test vehicle).