Cima NanoTech and Fujimori Kogyo team up in strategic partnership for commercial production of SANTE® Films

August 29 2013, Tokyo, Japan – Cima NanoTech, a smart materials company and developer of the SANTE® Self-Assembling Nanoparticle Technology, and Fujimori Kogyo, a top manufacturer of high quality opto-electronic films and materials, today announced their partnership and successful commercial mass production of SANTE® Films.

GSA EMEA Leadership Council Names New Chair

President of TSMC Europe to Lead Council in New Strategic Direction

+36dBm IIP3 Downconverting Mixer with Unprecedented 2.4dB Conversion Gain

MILPITAS, CA – September 3, 2013 – Linear Technology announces the LTC5551, an ultrahigh dynamic range RF down-converting mixer for applications that demand the very best in performance. The LTC5551 offers very high linearity of +36dBm IIP3, (input third-order intercept), and low 9.7dB noise figure comparable to the highest IIP3 passive mixers available.

Sand 9 Challenges Dominance of Quartz Timing Devices in Mobile Applications

Company’s TM361 and TM061 outperform competitive timing solutions—and support integration with mobile chipsets and low-power wireless connectivity devices

Samsung Widely Deploys Synopsys' Design Compiler Graphical for Mobile SoC Designs

Achieves Area and Power Reduction Critical to Success in the Mobile Market

• Broad deployment of Design Compiler Graphical for Samsung Mobile SoCs
• Reduced routing congestion leads to 10 percent smaller area for highly congested blocks
• Minimal use of Low-Vt cells reduces leakage power while meeting frequency goals

ARCOL Resistors Provide Heat in Space Probe

UK based ARCOL Resistors, the long established specialists in resistor technology, has a great deal of experience of providing products for custom requirements but faced a unique challenge when asked to provide resistors for a space programme.

ams invests over €25m to create dedicated in-house production capacity for analog 3D ICs

Soaring demand for stacked-die devices shows value of ams’ patented TSV fabrication technology

Unterpremstaetten, Austria (3 September, 2013), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensor solutions, today announced that it has invested over €25m to create dedicated 3D IC production capacity at its wafer fabrication plant near Graz, Austria.

ARM Acquires Advanced Display Technology from Cadence

Cadence and ARM Deepen Collaboration on High-End Mobile Device Development

Advanced Wireless Selects the Mentor Graphics Calibre Platform for Verification of Advanced GaAs Wireless ICs

WILSONVILLE, Ore., September 3, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced that Advanced Wireless Semiconductor Company (AWSC) has selected the Calibre® nmDRC™ and nmLVS™ products as their golden signoff physical verification solution for GaAs ICs targeted for mobile and other wireless applications.

New and Improved Tandem Diodes from STMicroelectronics Deliver Economical Alternative to Silicon Carbide

Geneva, September 3, 2013 – STMicroelectronics has unveiled its second generation of tandem diodes, which enable designers to cost-effectively enhance the energy efficiency of equipment such as power supplies, solar inverters, and e-transportation charging points.

Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon Taiwan 2013

Semicon Taiwan 2013, September 4-6, 2013, TWTC Nangang Exhibition Hall, Taipei, Taiwan, Booth 1024

congatec provides low-cost entry to 4th Generation Intel® Core™ processors on COM Express

The low-cost COM Express Type 6 module conga-TS87/i3-4102E is scalable up to the quad-core Intel® Core™ i7

Xilinx and National Instruments Honor LocalGrid Technologies with the All Programmable Innovation Award at NIWeek 2013

SAN JOSE, Calif., Aug. 29, 2013 – Xilinx, Inc. (NASDAQ: XLNX) and National Instruments (NASDAQ: NATI) today announced that LocalGrid Technologies, together with Toronto Hydro-Electric System Limited (Toronto Hydro), won the All Programmable Innovation Award presented by Xilinx at the Graphical System Design Achievement Awards ceremony held during NIWeek 2013, in Austin, Texas.

Pentek Introduces LVDS Digital I/O Module for Control and Data Capture Applications

• Provides 32-pairs of LVDS digital I/O
• User-configurable Virtex-6 FPGA
• Available in XMC, VPX, CompactPCI, AMC and PCIe
• Rugged, conduction-cooled option for demanding military and avionics applications

Imagination Technologies releases second generation tools for mobile GPU compute developers

First demonstration of video rate computational photography now running at Full HD resolution on commercially available Android platforms with PowerVR GPUs

Sidense OTP Helps Richtek Technology Give Customers Cost-Effective and Efficient Power Management Solutions

Sidense 1T-OTP chosen by Richtek for its Small Size, Low Cost and High Reliability

High Temperature Accelerometer from Measurement Specialties Operates in Temperatures to 170°C

MEMS-based 4604HT offers reliable, accurate measurement in harsh environments

TI introduces Tiva™ C Series TM4C123G USB+CAN Development Kit for ARM® Cortex™-M4 microcontroller development

New development kit provides compact, versatile evaluation platform for Tiva™ C Series TM4C123G MCUs, including robust software for easy USB and CAN connectivity

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