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FPGA Configurator Provides Miniaturized, High Speed Configuration Solution for Altera FPGAs

FC512 integrates CPLD and 512Mb Flash into 13x13mm BGA package

CAMARILLO, CALIF. – February 6, 2013 – Interconnect Systems Inc. (ISI), a leading provider of Next Level Integration solutions, today announced availability of the FC512 FPGA Configurator.

Inverting, Boost or Buck-Boost µModule Converter Delivers up to 700mA with Only Four Small Passive Components

MILPITAS, CA – February 5, 2013 – Linear Technology Corporation introduces the LTM8045, a 2.8V-18V input, multi-topology DC/DC µModule® (micromodule) converter, with onboard inductor, power switch and DC/DC controller delivering up to 700mA output current.

Altera Announces Upcoming Schedule of Events With the Financial Community 2013 - San Francisco, CA

SAN JOSE, Calif., Feb. 5, 2013 /PRNewswire/ -- Altera Corporation (Nasdaq: ALTR) today announced its scheduled participation in the following events with the financial community:

Goldman Sachs Technology and Internet Conference
San Francisco, CA
February 13, 4pm PST

Morgan Stanley Technology, Media & Telecom Conference
San Francisco, CA
February 25, 12:45pm PST

Phison Licenses Tensilica’s Dataplane Processor (DPU) for NAND Flash Memory Controllers and SSD Applications

SANTA CLARA, Calif. – February 5, 2013 –Tensilica®, Inc. today announced that Phison Electronics Corp., the Taiwanese global market leader in flash and USB controller technology, has licensed Tensilica's Xtensa® dataplane processor unit (DPU).

GLOBALFOUNDRIES and Samsung Support New Cadence Virtuoso Advanced Node for 20- and 14nm Processes

SAN JOSE, CA--(Marketwire - February 05, 2013) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that two of its major foundry partners -- Samsung Foundry and GLOBALFOUNDRIES -- are supporting new Cadence® custom/analog technology targeting designs at the advanced nodes of 20 and 14 nanometers.

Agilent Technologies and Alcatel-Lucent Bell Labs Collaborate to Demonstrate Record-Breaking Optical Signaling Agilent Oscilloscopes Enable Record Interface Rates

SANTA CLARA, Calif., Jan. 29, 2013 – Agilent Technologies Inc. (NYSE: A) today announced it has demonstrated the world’s fastest complex-modulation optical interface rates. A joint team from Alcatel-Lucent Bell Labs and Agilent conducted experiments using Infiniium 90000 Q-Series oscilloscopes to transmit data over long-haul distances at a record interface rate.

Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process

SAN JOSE, CA--(Marketwire - February 05, 2013) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that GLOBALFOUNDRIES has certified essential Cadence® technologies for custom/analog, digital and mixed-signal design, implementation, and verification for its 20-nanometer LPM technology.

SmartKem Launches Ink Evaluation Kit for ‘Flexible’ Thin Film Transistors

Technology transfer kit combines education and technical support to further advances in next generation flexible displays for use in smartphones and tablets

TI power management front-end chip increases battery run-time in ARM® Cortex A15-based designs

Highly integrated power management unit with 4-A charger reduces board space 60 percent, boosts battery life in tablets and portable electronics

Aldec Launches Free Online UVM Training

Henderson, NV – February 4, 2013 – Aldec, Inc., today announces the launch of Fast Track™ ONLINE, a convenient, online training portal that is available at no cost to the design verification community. In today’s competitive atmosphere, the ability to adopt new technology quickly and reduce design time cycles is critical.

Atmel Introduces New Family of Cortex-A5 Processor-Based MPUs For Embedded Industrial and Consumer Applications

Delivering 850DMIPS, Lower Power Consumption, Under 200mW in Active Mode, and Robust Security Features, SAMA5D3 Series Are Backed by Rich Peripherals and Easy-to-use Design Tools

Cadence to Present, Showcase Advanced FinFET Design Technology at Common Platform Technology Forum 2013

SANTA CLARA, CA--(Marketwire - February 04, 2013) - Cadence Design Systems, Inc. (NASDAQ: CDNS)

WHAT: Cadence Design Systems, Inc. (NASDAQ: CDNS)

Saelig Announces Sensor Solution to Monitor Driver Fatigue

Fairport, NY: Saelig Company, Inc. has introduced a novel solution to monitor driver fatigue that is based on Plessey's multi-award winning EPIC sensor technology. An array of EPIC electric potential sensors can be built into a vehicle seat back, with optimal sensing location chosen to eliminate differences in the operators' height and build.

TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process

Dresden, GERMANY – February 4, 2013 –Technische Universität (TU) Dresden, a leading German university in the field of electrical engineering, today announced the successful initial operation of a low-power test-chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES’ advanced 28nm Super Low Power (SLP) technology.

SiTime Expands Portfolio with +125C MEMS Oscillators for Industrial and High Reliability Applications

Best Robustness and Reliability are Ideal for Harsh Environments; Best Stability and Power Consumption Improve System Performance

SWS Licenses its Spectrometer Technology to Hamamatsu Photonics

SWS Licenses its Spectrometer Technology to Hamamatsu Photonics

World’s First Single-Chip Spectrometer is Poised to Significantly Increase the Market for Portable Spectrometry

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