FPGA News

Agilent Technologies’ New External Output Amplifier Extends Voltage Range of Existing Function Generators to 50Vpp

SANTA CLARA, Calif., Nov. 16, 2009 -- Agilent Technologies Inc. (NYSE: A) today introduced an economically priced 2-channel external output amplifier that provides up to 50 Vpp (Volts peak-to-peak) amplification of function/arbitrary waveforms. The instrument is designed to work in conjunction with engineers’ existing function generators to extend the voltage range and offer low-distortion outputs.

COSATEQ presents new desk Hardware-in-the-Loop solution

The new affordable modular desk HiL (Hardware-in-the-Loop) solution CompactHiL based on the ME-Neuron is available now.

The new affordable modular desk HiL (Hardware-in-the-Loop) solution CompactHiL based on the ME-Neuron is available now.

Bloor publishes in-depth Research Report on Artisan Studio

Washington DC, USA and Cheltenham, UK – 12th November 2009. Artisan® Software Tools, the world’s largest independent supplier of industrial-grade, collaborative modeling tools for complex, mission and safety-critical embedded systems and software, has announced that Bloor Research has published one of its “InDetail” research reports on Artisan Studio.

ABI Research confirms NXP’s Leadership in Contactless IC market

NXP Rated #1 in Contactless Transaction IC Vendor Matrix for the third year in a row

NXP Rated #1 in Contactless Transaction IC Vendor Matrix for the third year in a row

Lattice And Beyond Semiconductor To Collaborate In Processor Compiler Tools Development

HILLSBORO, OR -- NOVEMBER 10, 2009 -- Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced it will collaborate with Beyond Semiconductor in the development of compiler tools for Lattice’s soft processors. The collaboration will include updates and performance improvements for Lattice’s embedded processor IP compilers and development tools.

New Lattice FPGA Design Tool Suite Includes Advanced Support For High Performance DDR Interfaces

-- Version 8.0 Software Helps Build High Speed, Robust, Double Data Rate Interfaces --

-- Version 8.0 Software Helps Build High Speed, Robust, Double Data Rate Interfaces --

Artisan continues industry consolidation with Extessy merger

- Extessy adds system requirements, co-simulation, integration and test tools to Artisan’s product portfolio - Further extends Artisan’s professional services capability and expands German operations

- Extessy adds system requirements, co-simulation, integration and test tools to Artisan’s product portfolio

- Further extends Artisan’s professional services capability and expands German operations

Lattice Updates Software Design Tools For Hot Swap Control and Power Management

– PAC-Designer 5.2 Tools Support New Power Manager II Devices; Ideal for Integrated Hot Swap Control, Supervision and Sequencing; Adds HDL Verification to Flow –

– PAC-Designer 5.2 Tools Support New Power Manager II Devices; Ideal for Integrated Hot Swap Control, Supervision and Sequencing; Adds HDL Verification to Flow –

OSCI Introduces SystemC Synthesis Subset Draft Standard – Opens for Public Review - Review Period Runs Through January 31, 2010

WHO: The Open SystemC Initiative (OSCI), an independent, non-profit organization dedicated to supporting and advancing SystemC™ as an industry-standard language for electronic system-level (ESL) design, today announced the release of the draft 1.3 standard of the SystemC Synthesis Subset.

Agilent Technologies' Expanded HDMI Test Solution Portfolio on Display at CEA 861/HDCP PlugFest13

Latest Additions Increase Efficiencies, Lower Cost, Address Requirements of the HDMI 1.4 Specification

Latest Additions Increase Efficiencies, Lower Cost, Address Requirements of the HDMI 1.4 Specification

Agilent Technologies, Nexus Technology Deliver DDR3 Memory Bus Debug Solutions

SANTA CLARA, Calif., and Nashua, NH, Nov. 9, 2009 -- Agilent Technologies Inc. and Nexus Technology Inc. today made available DDR3-1867 DIMM and DDR3-1600 SODIMM slot interposer test solutions. These test solutions are the ideal tools for designers performing DDR3 DIMM or SODIMM validation, failure analysis, and bus functional-parametric validation in servers, supercomputing, desktops, laptops and computing applications.

Actions Semiconductor Adopts S2C's ASIC Prototyping Tool

<p><span style="font-size: 11pt; line-height: 115%">S2C Inc.,announced that both S2C's application-specific integrated circuit (ASIC) prototyping hardware and software have been widely adopted in Actions Semiconductor's SoC design flow.</span></p>

Shanghai, China – October 12th, 2009 – S2C Inc., an advanced system-on-chip (SoC) design solutions provider, today announced that both S2C's application-specific integrated circuit (ASI

EDA Solutions announces Tanner EDA process design kit support for X-FAB’s 0.18µm technologies

Fareham, UK: EDA Solutions announces that X-FAB has released two 0.18µm process design kits (PDK) for Tanner Tools Pro on X-TIC, X-FAB's online technical database. Tanner Tools Pro is the software suite for the design, layout and verification of analog, mixed-signal (A/MS), RF and MEMS ICs from Tanner EDA, the world leader in PC-based A/MS and MEMS circuit design software. The release of this new kit extends X-FAB’s PDK support for Tanner tools, adding X-FAB's 0.18µm processes to the range of technologies currently supported (0.35, 0.6, 0.8 and 1.0µm).

Wintegra incorporates PCI Express® IP in its WinPath3 processors

<p>PLDA&rsquo;s quality design and Ease of migration from legacy PCI to PCI Express interface delivers the right blend of features for Wintegra&rsquo;s third generation WinPath devices</p>

November 03rd, 2009 – PLDA, the industry leader in the high-speed bus IP market, announced that Wintegra has chosen PLDA’s PCI Express IP for their latest WinPath3 processor.

Moschip’s MCS 8142, MCS 8144 & MCS9990 reach volume production with PLDA PCI Express® IP

<p>PLDA, the industry leader in the high-speed bus IP market, announced that MosChip Semiconductor Technology, Ltd. has successfully launched their MCS9990.</p>

October 19, 2009 – PLDA, the industry leader in the high-speed bus IP market, announced that MosChip Semiconductor Technology, Ltd.

Synopsys chosen by Realtek as its primary EDA partner

MOUNTAIN VIEW, Calif., Nov. 5, 2009 - Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Realtek Semiconductor Corp, a leading provider of advanced IC products for communications network, computer peripheral and multimedia applications, has signed an expanded business agreement establishing Synopsys as its primary EDA partner.

Infineon and TSMC Extend Technology And Production Partnership Agreement; Will Jointly Develop 65nm Embedded Flash Process Technology For Automotive and Chip Card Applications

NEUBIBERG, Germany and HSINCHU, Taiwan, R.O.C., Nov. 5 /PRNewswire-FirstCall/ -- Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) today announced that they are extending their development and production partnership to a 65nanometer (nm) embedded flash (eFlash) process technology targeting next generation automotive, chip card and security applications.

Digi-Key Corporation Launches Digi-Key Toolbar Version 2

Redesign based on customer feedback includes new customization features

Redesign based on customer feedback includes new customization features

Thief River Falls, Minnesota (USA) — November 5, 2009 — Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry's broadest selection of electronic components available for immediate shipment, today announced the launching of a newly redesigned version of its toolbar.

SUNDANCE FEATURES NEW Texas Instruments TMS320C6472 MULTICORE DSP in its EVP6472 DEVELOPMENT PLATFORM

<p><i><span style="font-weight: normal; font-size: 10pt; line-height: 150%">Sundance EVP6472 <span style="color: black">Platform</span> Integrates&nbsp; 3+ GHz Multicore DSP To Provide Cost-Performance Leadership </span></i></p>

 

VisualSim enabled engineers to architect the software and processor to achieve 800 Teraflops for a Real-Time Ray Tracing system

Sunnyvale, CA and Tokyo, Japan. — Nov 3rd, 2009 — Mirabilis Design Inc., today announced that VisualSim was used by a joint venture project involving TOPS Systems of Japan, to model, simulate and analyze the performance of a Real-Time Ray Tracing system with distributed software and a heterogeneous Multi-Core processor. The architecture development and software partitioning were conducted by developing performance and power models using the standard libraries in the VisualSim graphical environment.

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