EMA Automates the Creation and Setup of OrCAD Capture CIS Component Databases

Plug-in app creates a well structured database for shared usage by an entire engineering team ensuring part uniformity across all designs

Libelium announces e-Learning Platform for ZigBee sensor networks

New e-Learning platform enables system integrators worldwide to accelerate time to market for ZigBee sensor network projects and applications

Movidius and Toshiba Electronics Europe collaborate on high resolution 3D system solution for smartphones

Movidius to demo MA1178’s high quality 3D imaging capabilities at MWC 2012

Dublin, Ireland and Duesseldorf, Germany, 1 February 2012 – Movidius, the mobile multimedia processor company, today announced it has partnered with Toshiba Electronics Europe to develop a complete 3D system solution for the smartphone market.

Maxim’s Hi-Speed USB Protectors Deliver Automotive-Grade Protection for Mobile Connectivity

Maxim Integrated Products provides robust ESD protection with its fully integrated USB 2.0 protectors to safely and quickly connect drivers to mobile devices.

Express Logic Brings High Performance to Cortex-M4 with ThreadX® RTOS and NetX Duo™ TCP/IP Stack

San Diego, CA, February 1, 2012 – Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced that it has ported its popular ThreadX RTOSand NetX TCP/IP stack to support a wide range of processors based on ARM’s Cortex-M4™.

Avnet Electronics Marketing Introduces the Xilinx Kintex™-7 FPGA DSP Development Kit with High-Speed Analog

Avnet Electronics Marketing and Xilinx once again team up to release a new FPGA DSP Development Kit, this time featuring High-Speed Analog support.

Avnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT), announced today the Xilinx Kintex™-7 FPGA DSP Development Kit with High-Speed Analog, supporting Xilinx’s 7 series Targeted Design Platforms.

Xilinx Launches First Design Platforms for Accelerating 7 Series FPGA Design Productivity and System Integration

See Industry's First Complete Development Kits for Increasing System Performance, Lowering Power, and Reducing BoM with 28nm FPGA Technology at DesignCon 2012

R&S ZNB Network Analyzer from Rohde & Schwarz Uses the SET2DIL Signal Integrity Technique To Validate High-Speed Differential Bus Performance on PCBs

Columbia, MD, January 31, 2012 — Utilizing SET2DIL (Single-Ended to Differential Insertion Loss) algorithm for validating high-speed differential transmission line performance on printed circuit boards (PCBs), the R&S ZNB network analyzer is a high-performance network analyzer that provides a wide dynamic range with high accuracy, short measurement time and ease of use.

Agilent Technologies Introduces Precision Waveform Analyzer Module with Industry-Best Performance

Oscilloscope Module Helps Engineers Easily and Accurately Characterize 10-Gb/s to 32-Gb/s Designs

SANTA CLARA, Calif., Jan. 31, 2012 – Agilent Technologies Inc. (NYSE: A) today introduced a precision waveform analyzer for engineers involved in design verification and validation of high-speed electrical communications systems and components.

Combining Molex Connector Solutions for Future-Proof End-to-End 25 Gbps Channel Interoperability

Delivering a seamless flow of data in next-generation storage and networking applications, high-speed connector technologies offer future-proof framework for 100 Gbps speeds

GSA Semiconductor Leaders Forum emphasized innovation and industrial cooperation cohesion

10 January 31, 2012 in Taipei, Taiwan - The 2012 GSA Semiconductor Leaders Forum (GSA Semiconductor Leaders Forum Taiwan) for the semiconductor industry to not miss the annual event. Entered organized by the eighth year, and this year will be on Wednesday, November 7, the Ambassador Hotel in Hsinchu grand debut.

Cortus and SST to Jointly Exhibit Low Power IP Solutions for System on Chip (SoC) Design at Embedded World 2012

Exhibit will combine Cortus’ silicon efficient, ultra low power 32 bit microcontroller cores with SST’s low power, ultra high endurance embedded flash non-volatile memory (NVM) technology.

Thomas H. Waechter Joins Altera Board of Directors

San Jose, Calif., January 26, 2012—Altera Corporation (NASDAQ: ALTR) today announced that Thomas H. Waechter joined the company's board of directors on January 26, 2012. Mr. Waechter currently is the president, chief executive officer and a member of the board of directors of JDS Uniphase Corporation (JDSU) (NASDAQ: JDSU; and TSX: JDU). Prior to joining JDSU in 2007, Mr.

Xilinx Discusses Stacked Silicon Interconnect Technologies and Demonstrates Newest 28nm 7 Series FPGAs at DesignCon 2012

SAN JOSE, Calif., Jan. 26, 2012 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced participation at DesignCon 2012 in Santa Clara, from January 30 – February 2, at the Santa Clara Convention Center, Booth #732.

Altera Experts Discuss Transceiver Technology, Floating Point DSP and Signal Integrity at DesignCon 2012

San Jose, Calif. January 25, 2012 – Altera Corporation (NASDAQ: ALTR) today announced its participation at DesignCon 2012. Experts from Altera will showcase how they are solving some of the industry's most complex design challenges through 28-nm FPGA architectural innovations and advanced technologies that enable high-speed I/O performance, floating point DSP and best-in-class signal integrity.

Global Semiconductor Alliance Establishes Capital Lite Working Group

Group Serves as Engine for Innovation and Growth

SAN JOSE, Calif. (January 24, 2012) - The Global Semiconductor Alliance (GSA), announces the formation of the Capital Lite Working Group whose primary focus is helping new semiconductor start-ups reduce costs, raise equity financing and improve their chance of success by providing new business models, partnerships and tools.

Altera Announces Fourth Quarter Results

Cash flow from operating activities in 2011 was $959.6 million. Altera ended the quarter with $3.5 billion in cash and investments.

Altera's board of directors has declared a quarterly cash dividend of $0.08 per share payable on March 1, 2012 to stockholders of record on February 10, 2012.

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