LRC-S1 is a Robust Solution for Cranes, Lifting Equipment and other Industrial Machines

PHOENIX—August 26, 2013 - Today, Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: AVT), released an enhanced Wi-Go Module, a wireless accessory module for the Freescale® Freedom development platform, the FRDM-KL25Z, along with new training support.

The most feature rich low-power Kinetis L series MCU device to date with multiple onboard sensors and Segment LCD.

CHICAGO – August 23, 2013 – Newark element14 has announced it will stock the new Freescale Freedom development platform, the FRDM-KL46Z, the most advanced and feature rich development platform based on the Kinetis L series of MCUs.

Students, Faculty, Institutions are invited and encouraged to participate

Eurocom is launching its 2013 Education Program just in time for the new school year. A scholarship is being offered to students to use toward a custom built, fully upgradeable laptop from Eurocom. Further initiatives to assist students to acquire the hardware that they need will be launched over the next month.

The PLR3311 Protects Against ESD and EFT in Ethernet, FireWire, Wireless Devices, USB Interfaces and More

Who

Real Intent, whose advanced verification solutions accelerate electronic design sign-off, eliminate complex failures in SoCs, and lead the market in performance, capacity, accuracy and completeness

What

SAN JOSE, Calif., Aug. 23, 2013 /PRNewswire/ -- Altera Corporation (Nasdaq: ALTR) today announced that it will participate in the Citi Global Technology Conference in New York, NY. Altera's presentation is scheduled for Wednesday, September 4th at 9:45am Eastern Time.

About Altera

Fairport, NY, USA: Saelig Company, Inc.- The RevEng System is a remarkable reverse-engineering hardware tool for creating professional quality circuit schematic diagrams from a sample PCB that lacks documentation. The RevEng System consists of a PC-controlled continuity-detecting hardware system, RevWin control software, and EdWin, a fully featured CAD package.

Latest Breakthroughs in Group IV Element-Based Photonic Materials, Devices and Silicon Photonics to be Presented at 10th IEEE Conference