Xilinx Joins Semiconductor Industry Leaders at ConFab 2012: "Managing the New Economics of Semiconductor Manufacturing"
Execs to share key insights into successful collaboration with supply chain partners & case studies behind the design of breakthrough All Programmable 28nm technologies, devices
SAN JOSE, Calif., May 31, 2012 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at The ConFab 2012 Conference at The Encore at The Wynn in Las Vegas from June 3 - 6, 2012.
Xin Wu, Xilinx senior director of silicon technology, and Sandeep Bharathi, Xilinx vice president of engineering, and will join semiconductor fabrication industry leaders and decision makers from around the world to share perspectives on managing the new economics of semiconductor manufacturing.
What: The ConFab 2012 Conference
Where: The Encore at The Wynn Las Vegas, Las Vegas, Nevada
When: June 3 - 6, 2012
Wu and Bharathi are participating in the Foundry-Fabless Supply Chain and Advanced Packaging and Progress in 3D Integration sessions on Tuesday, June 5, 2012. They will provide key insights into Xilinx's successful strategy to increase customer value with All Programmable 28nm technologies and devices that deliver a completely new level of programmable systems integration - well beyond what Moore's Law alone can provide - increasing system performance, lowering total system power and significantly reducing bill of materials (BOM) costs.
They will highlight critical factors for successful collaboration with supply chain partners and provide an in-depth look behind the design of its All Programmable technologies and devices, which extend far beyond traditional programmable logic to enable both hardware and software programmability, integrate both digital and analog mixed-signal functions, and allow new levels of programmable interconnect in both monolithic and multi-die 3D ICs.
Session 3: The Foundry-Fabless Supply Chain
Tuesday, June 5
8:45 - 10:15 a.m., The Encore at The Wynn Las Vegas
28nm Case Study: Successful Fabless & Foundry Collaboration
Wu will describe Xilinx's strategy for riding the leading edge of each new process node to deliver pioneering All Programmable technology innovations. He will highlight critical success factors for fabless-foundry collaboration with a case study of the world's first 28nm FPGAs.
Session 4: Advanced Packaging and Progress in 3D Integration
Tuesday, June 5
2:15 - 3:45 p.m., The Encore at The Wynn Las Vegas
The Evolution of 3D ICs: Leaping Ahead of Moore's Law to Deliver a 6.8B Transistor Device
Bharathi's talk will focus on the evolution 3D ICs, comparative approaches by industry pioneers, and a 28nm 3D IC case study of the world's highest capacity FPGA and first heterogeneous 3D FPGA , both built using Xilinx's revolutionary stacked silicon interconnect (SSI) technology. The case study will cover technology, applications and power benefits. It will conclude with a 3D standards call to action for our industry.
About The ConFab
Entering its eighth year, The ConFab is an exclusive invitation-only global conference and business meeting where executives from semiconductor equipment and material suppliers can meet with key decision makers from manufacturers of semiconductors, LEDs, MEMS and other types of electronics. At The ConFab, these executives discuss business and technology issues and collaborate on future strategic development in device manufacturing. Ample time is available for private face-to-face meetings between equipment and material suppliers and manufacturers. Attendance is by invitation only and attendees are prescreened to verify that they are key participants in the buying process. For sponsorship information, please contact Sabrina Straub. For more information about attending as our VIP guest, please contact Luba Hrynyk.
Xilinx is the world's leading provider of All Programmable technologies and devices, going beyond traditional programmable logic to enable both hardware and software programmability, integrate both digital and analog mixed-signal functions, and allow new levels of programmable interconnect in both monolithic and multi-die 3D ICs. The company's products are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration.