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  #1 (permalink)  
Old 07-22-2009, 02:46 AM
[email protected]
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Posts: n/a
Default [SI-LIST] Backdrill under BGA

SI Gurus,
Has anybody done back drilling on BGA vias for multi gig traces?
is that achievable? If so, what was the via structure?

-Sam





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  #2 (permalink)  
Old 07-22-2009, 04:12 AM
David Mullenex
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Posts: n/a
Default [SI-LIST] Re: Backdrill under BGA

Sam,

The critical factors missing here*are*your BGA pitch and location of the proposed back-drills relative to the BGA grid and each other. This as Back-drilled vias*require larger anti-pads to accomodate the larger diameter of the back-drill head that assures removal of the matal stub, as well as the minor mis-alignment tollerace for the back-drill. Note, that you will also lose routing channels on the back drilled layers due to the larger antipad and back-drill diameter.

Looking at the drill size, anti-pad, routing channels, board thickness, and ground/power plane coverage under the BGA, may indicate that back-drilling is not the preffered solution for fine pitch BGAs. Also, selection of the right routing layers and pad stack may allow you to get by with negligable stubs... assuming you do not have a boat load of multi-gig signals on a poorly pinned-out BGA.

Porvide more details here or work with your fab house to arrive at the*manufacturable solution.

cheers,
- David.


----- Original Message ----
From: "cygnul (AT) yahoo (DOT) com" <cygnul (AT) yahoo (DOT) com>
To: si-list (AT) freelists (DOT) org
Sent: Tuesday, July 21, 2009 5:46:21 PM
Subject: [SI-LIST] Backdrill under BGA

SI Gurus,
Has anybody done back drilling on BGA vias for multi gig traces?
is that achievable? If so, what was the via structure?

-Sam



* * *

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  #3 (permalink)  
Old 07-22-2009, 06:15 PM
qazi
Guest
 
Posts: n/a
Default [SI-LIST] Re: Backdrill under BGA

Sam,

Yes we have back drilled in GHz boards. It works pretty well.

Cadence has a built in feature to define back drills and their depths. If
you are using Mentors (PADs) you might have to manually locate the vias (or
use a separate drill size than the others).
The antipad and layer stackup plays the main role. I can send you an example
setup if you are interested to take a look.

-Qazi

-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On
Behalf Of cygnul (AT) yahoo (DOT) com
Sent: Tuesday, July 21, 2009 5:46 PM
To: si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Backdrill under BGA

SI Gurus,
Has anybody done back drilling on BGA vias for multi gig traces?
is that achievable? If so, what was the via structure?

-Sam





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  #4 (permalink)  
Old 07-22-2009, 06:35 PM
Bill Stube
Guest
 
Posts: n/a
Default [SI-LIST] Re: Backdrill under BGA

Sam,

I do not have experience with backdrilling under BGAs specifically.

My suggestion would be to avoid putting vias on the signal at BGA in the first place, or if you must have vias to transition from layer 1 to layer N and avoid the stub. I realize this doesn't exactly address your question, but if you avoid having a via/stub altogether, you will avoid the added complexity and cost of having to backdrill and account for the items David mentions below.

Just thought I would throw it out there.

Bill Stube
Hardware Engineer

Plexus - http://www.plexus.com
The Product Realization Company


-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On Behalf Of David Mullenex
Sent: Wednesday, July 22, 2009 4:13 AM
To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA


Sam,

The critical factors missing here*are*your BGA pitch and location of the proposed back-drills relative to the BGA grid and each other. This as Back-drilled vias*require larger anti-pads to accomodate the larger diameter of the back-drill head that assures removal of the matal stub, as well as the minor mis-alignment tollerace for the back-drill. Note, that you will also lose routing channels on the back drilled layers due to the larger antipad and back-drill diameter.

Looking at the drill size, anti-pad, routing channels, board thickness, and ground/power plane coverage under the BGA, may indicate that back-drilling is not the preffered solution for fine pitch BGAs. Also, selection of the right routing layers and pad stack may allow you to get by with negligable stubs... assuming you do not have a boat load of multi-gig signals on a poorly pinned-out BGA.

Porvide more details here or work with your fab house to arrive at the*manufacturable solution.

cheers,
- David.


----- Original Message ----
From: "cygnul (AT) yahoo (DOT) com" <cygnul (AT) yahoo (DOT) com>
To: si-list (AT) freelists (DOT) org
Sent: Tuesday, July 21, 2009 5:46:21 PM
Subject: [SI-LIST] Backdrill under BGA

SI Gurus,
Has anybody done back drilling on BGA vias for multi gig traces?
is that achievable? If so, what was the via structure?

-Sam
------------------------------------------------------------------
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  #5 (permalink)  
Old 07-22-2009, 06:40 PM
Aubrey Sparkman
Guest
 
Posts: n/a
Default [SI-LIST] Re: Backdrill under BGA

We looked at backdrilling an 82 mil thick pcb under a 1mm (40 mils) pitch
BGA once. Almost all of the low cost PCB suppliers said no.


Aubrey Sparkman
Aubrey.K.Sparkman (AT) ieee (DOT) org

-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On
Behalf Of Bill Stube
Sent: Wednesday, July 22, 2009 11:36 AM
To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA

Sam,

I do not have experience with backdrilling under BGAs specifically.

My suggestion would be to avoid putting vias on the signal at BGA in the
first place, or if you must have vias to transition from layer 1 to layer N
and avoid the stub. I realize this doesn't exactly address your question,
but if you avoid having a via/stub altogether, you will avoid the added
complexity and cost of having to backdrill and account for the items David
mentions below.

Just thought I would throw it out there.

Bill Stube
Hardware Engineer

Plexus - http://www.plexus.com
The Product Realization Company


-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On
Behalf Of David Mullenex
Sent: Wednesday, July 22, 2009 4:13 AM
To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA


Sam,

The critical factors missing here*are*your BGA pitch and location of the
proposed back-drills relative to the BGA grid and each other. This as
Back-drilled vias*require larger anti-pads to accomodate the larger diameter
of the back-drill head that assures removal of the matal stub, as well as
the minor mis-alignment tollerace for the back-drill. Note, that you will
also lose routing channels on the back drilled layers due to the larger
antipad and back-drill diameter.

Looking at the drill size, anti-pad, routing channels, board thickness, and
ground/power plane coverage under the BGA, may indicate that back-drilling
is not the preffered solution for fine pitch BGAs. Also, selection of the
right routing layers and pad stack may allow you to get by with negligable
stubs... assuming you do not have a boat load of multi-gig signals on a
poorly pinned-out BGA.

Porvide more details here or work with your fab house to arrive at
the*manufacturable solution.

cheers,
- David.


----- Original Message ----
From: "cygnul (AT) yahoo (DOT) com" <cygnul (AT) yahoo (DOT) com>
To: si-list (AT) freelists (DOT) org
Sent: Tuesday, July 21, 2009 5:46:21 PM
Subject: [SI-LIST] Backdrill under BGA

SI Gurus,
Has anybody done back drilling on BGA vias for multi gig traces?
is that achievable? If so, what was the via structure?

-Sam
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Old (prior to June 6, 2001) list archives are viewable at:
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------------------------------------------------------------------
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List technical documents are available at:
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Old (prior to June 6, 2001) list archives are viewable at:
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Reply With Quote
  #6 (permalink)  
Old 07-22-2009, 06:54 PM
Tabatchnick, Justin
Guest
 
Posts: n/a
Default [SI-LIST] Re: Backdrill under BGA

What is the data rate , rise time , maximum stub length, and dielectric constant . For an 82 mil board and reasonable data rates , you may not have to worry about back drilling at all because stub length may not be significant as compared to rise time wave length.

Justin Tabatchnick
SI , Intel

-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On Behalf Of Aubrey Sparkman
Sent: Wednesday, July 22, 2009 9:41 AM
To: 'Bill Stube'; cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA

We looked at backdrilling an 82 mil thick pcb under a 1mm (40 mils) pitch
BGA once. Almost all of the low cost PCB suppliers said no.


Aubrey Sparkman
Aubrey.K.Sparkman (AT) ieee (DOT) org

-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On
Behalf Of Bill Stube
Sent: Wednesday, July 22, 2009 11:36 AM
To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA

Sam,

I do not have experience with backdrilling under BGAs specifically.

My suggestion would be to avoid putting vias on the signal at BGA in the
first place, or if you must have vias to transition from layer 1 to layer N
and avoid the stub. I realize this doesn't exactly address your question,
but if you avoid having a via/stub altogether, you will avoid the added
complexity and cost of having to backdrill and account for the items David
mentions below.

Just thought I would throw it out there.

Bill Stube
Hardware Engineer

Plexus - http://www.plexus.com
The Product Realization Company


-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On
Behalf Of David Mullenex
Sent: Wednesday, July 22, 2009 4:13 AM
To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA


Sam,

The critical factors missing here*are*your BGA pitch and location of the
proposed back-drills relative to the BGA grid and each other. This as
Back-drilled vias*require larger anti-pads to accomodate the larger diameter
of the back-drill head that assures removal of the matal stub, as well as
the minor mis-alignment tollerace for the back-drill. Note, that you will
also lose routing channels on the back drilled layers due to the larger
antipad and back-drill diameter.

Looking at the drill size, anti-pad, routing channels, board thickness, and
ground/power plane coverage under the BGA, may indicate that back-drilling
is not the preffered solution for fine pitch BGAs. Also, selection of the
right routing layers and pad stack may allow you to get by with negligable
stubs... assuming you do not have a boat load of multi-gig signals on a
poorly pinned-out BGA.

Porvide more details here or work with your fab house to arrive at
the*manufacturable solution.

cheers,
- David.


----- Original Message ----
From: "cygnul (AT) yahoo (DOT) com" <cygnul (AT) yahoo (DOT) com>
To: si-list (AT) freelists (DOT) org
Sent: Tuesday, July 21, 2009 5:46:21 PM
Subject: [SI-LIST] Backdrill under BGA

SI Gurus,
Has anybody done back drilling on BGA vias for multi gig traces?
is that achievable? If so, what was the via structure?

-Sam
------------------------------------------------------------------
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For help:
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List archives are viewable at:
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Old (prior to June 6, 2001) list archives are viewable at:
http://www.qsl.net/wb6tpu



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or at our remote archives:
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Old (prior to June 6, 2001) list archives are viewable at:
http://www.qsl.net/wb6tpu


------------------------------------------------------------------
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or to administer your membership from a web page, go to:
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Old (prior to June 6, 2001) list archives are viewable at:
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Reply With Quote
  #7 (permalink)  
Old 07-22-2009, 06:57 PM
Gumaste, Vijaylaxmi
Guest
 
Posts: n/a
Default [SI-LIST] Re: Backdrill under BGA

Sam,


It depends on how many multi gig traces/via are needed in BGA design.

You could try eliminating stub altogether by transition from top to last layer; and design a transparent via to account for capacitance using a 3D field solver.



Other options - use coreless substrates or build-up substrates with blind/buried vias.







-Vijaya



-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On Behalf Of Aubrey Sparkman
Sent: Wednesday, July 22, 2009 9:41 AM
To: 'Bill Stube'; cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA



We looked at backdrilling an 82 mil thick pcb under a 1mm (40 mils) pitch

BGA once. Almost all of the low cost PCB suppliers said no.





Aubrey Sparkman

Aubrey.K.Sparkman (AT) ieee (DOT) org



-----Original Message-----

From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On

Behalf Of Bill Stube

Sent: Wednesday, July 22, 2009 11:36 AM

To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org

Subject: [SI-LIST] Re: Backdrill under BGA



Sam,



I do not have experience with backdrilling under BGAs specifically.



My suggestion would be to avoid putting vias on the signal at BGA in the

first place, or if you must have vias to transition from layer 1 to layer N

and avoid the stub. I realize this doesn't exactly address your question,

but if you avoid having a via/stub altogether, you will avoid the added

complexity and cost of having to backdrill and account for the items David

mentions below.



Just thought I would throw it out there.



Bill Stube

Hardware Engineer



Plexus - http://www.plexus.com

The Product Realization Company





-----Original Message-----

From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On

Behalf Of David Mullenex

Sent: Wednesday, July 22, 2009 4:13 AM

To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org

Subject: [SI-LIST] Re: Backdrill under BGA





Sam,



The critical factors missing here are your BGA pitch and location of the

proposed back-drills relative to the BGA grid and each other. This as

Back-drilled vias require larger anti-pads to accomodate the larger diameter

of the back-drill head that assures removal of the matal stub, as well as

the minor mis-alignment tollerace for the back-drill. Note, that you will

also lose routing channels on the back drilled layers due to the larger

antipad and back-drill diameter.



Looking at the drill size, anti-pad, routing channels, board thickness, and

ground/power plane coverage under the BGA, may indicate that back-drilling

is not the preffered solution for fine pitch BGAs. Also, selection of the

right routing layers and pad stack may allow you to get by with negligable

stubs... assuming you do not have a boat load of multi-gig signals on a

poorly pinned-out BGA.



Porvide more details here or work with your fab house to arrive at

the manufacturable solution.



cheers,

- David.





----- Original Message ----

From: "cygnul (AT) yahoo (DOT) com" <cygnul (AT) yahoo (DOT) com>

To: si-list (AT) freelists (DOT) org

Sent: Tuesday, July 21, 2009 5:46:21 PM

Subject: [SI-LIST] Backdrill under BGA



SI Gurus,

Has anybody done back drilling on BGA vias for multi gig traces?

is that achievable? If so, what was the via structure?



-Sam

------------------------------------------------------------------

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For help:

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List technical documents are available at:

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List archives are viewable at:

http://www.freelists.org/archives/si-list

or at our remote archives:

http://groups.yahoo.com/group/si-list/messages

Old (prior to June 6, 2001) list archives are viewable at:

http://www.qsl.net/wb6tpu







------------------------------------------------------------------

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or to administer your membership from a web page, go to:

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For help:

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List technical documents are available at:

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List archives are viewable at:

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or at our remote archives:

http://groups.yahoo.com/group/si-list/messages

Old (prior to June 6, 2001) list archives are viewable at:

http://www.qsl.net/wb6tpu







------------------------------------------------------------------
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For help:
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Reply With Quote
  #8 (permalink)  
Old 07-22-2009, 07:11 PM
Aubrey Sparkman
Guest
 
Posts: n/a
Default [SI-LIST] Re: Backdrill under BGA

Justin,

You are correct in that an 82 mil board with 6.4GT/s or less data rates
doesn't need back drill for the usual reasons.


Aubrey Sparkman
Aubrey.K.Sparkman (AT) ieee (DOT) org

-----Original Message-----
From: Tabatchnick, Justin [mailto:justin.tabatchnick (AT) intel (DOT) com]
Sent: Wednesday, July 22, 2009 11:54 AM
To: Aubrey Sparkman; 'Bill Stube'; cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: RE: [SI-LIST] Re: Backdrill under BGA

What is the data rate , rise time , maximum stub length, and dielectric
constant . For an 82 mil board and reasonable data rates , you may not have
to worry about back drilling at all because stub length may not be
significant as compared to rise time wave length.

Justin Tabatchnick
SI , Intel

-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On
Behalf Of Aubrey Sparkman
Sent: Wednesday, July 22, 2009 9:41 AM
To: 'Bill Stube'; cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA

We looked at backdrilling an 82 mil thick pcb under a 1mm (40 mils) pitch
BGA once. Almost all of the low cost PCB suppliers said no.


Aubrey Sparkman
Aubrey.K.Sparkman (AT) ieee (DOT) org

-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On
Behalf Of Bill Stube
Sent: Wednesday, July 22, 2009 11:36 AM
To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA

Sam,

I do not have experience with backdrilling under BGAs specifically.

My suggestion would be to avoid putting vias on the signal at BGA in the
first place, or if you must have vias to transition from layer 1 to layer N
and avoid the stub. I realize this doesn't exactly address your question,
but if you avoid having a via/stub altogether, you will avoid the added
complexity and cost of having to backdrill and account for the items David
mentions below.

Just thought I would throw it out there.

Bill Stube
Hardware Engineer

Plexus - http://www.plexus.com
The Product Realization Company


-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On
Behalf Of David Mullenex
Sent: Wednesday, July 22, 2009 4:13 AM
To: cygnul (AT) yahoo (DOT) com; si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Re: Backdrill under BGA


Sam,

The critical factors missing here*are*your BGA pitch and location of the
proposed back-drills relative to the BGA grid and each other. This as
Back-drilled vias*require larger anti-pads to accomodate the larger diameter
of the back-drill head that assures removal of the matal stub, as well as
the minor mis-alignment tollerace for the back-drill. Note, that you will
also lose routing channels on the back drilled layers due to the larger
antipad and back-drill diameter.

Looking at the drill size, anti-pad, routing channels, board thickness, and
ground/power plane coverage under the BGA, may indicate that back-drilling
is not the preffered solution for fine pitch BGAs. Also, selection of the
right routing layers and pad stack may allow you to get by with negligable
stubs... assuming you do not have a boat load of multi-gig signals on a
poorly pinned-out BGA.

Porvide more details here or work with your fab house to arrive at
the*manufacturable solution.

cheers,
- David.


----- Original Message ----
From: "cygnul (AT) yahoo (DOT) com" <cygnul (AT) yahoo (DOT) com>
To: si-list (AT) freelists (DOT) org
Sent: Tuesday, July 21, 2009 5:46:21 PM
Subject: [SI-LIST] Backdrill under BGA

SI Gurus,
Has anybody done back drilling on BGA vias for multi gig traces?
is that achievable? If so, what was the via structure?

-Sam
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  #9 (permalink)  
Old 07-27-2009, 09:58 PM
Tony Luan
Guest
 
Posts: n/a
Default [SI-LIST] Re: Backdrill under BGA

Hi Sam,
It is definitely achievable. Please check your PCB vendors. They will be able to tell the exact manufacturing limit for via size, back-drilling size and antipad clearance.

BR
Tony

-----Original Message-----
From: si-list-bounce (AT) freelists (DOT) org [mailto:si-list-bounce (AT) freelists (DOT) org] On Behalf Of cygnul (AT) yahoo (DOT) com
Sent: Tuesday, July 21, 2009 5:46 PM
To: si-list (AT) freelists (DOT) org
Subject: [SI-LIST] Backdrill under BGA

SI Gurus,
Has anybody done back drilling on BGA vias for multi gig traces?
is that achievable? If so, what was the via structure?

-Sam





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