FPGA Central

Technical Paper Newsletter 4-22-2009 Tech Paper Library Home  NEW FEATURED TECHNICAL PAPERS Applying Multi-core and Virtualization to Industrial and Safety-Related Applications
Intel and Wind River
Read this paper and watch this webinar to learn how multicore and virtualization can help you improve device performance, reduce costs through hardware consolidation, and upgrade applications more cost effectively throughout the product lifecycle.
Low-Power RF Guide
Texas Instruments
The new updated Low-Power RF Selection Guide from Texas Instruments includes product overviews for RF transceivers, transmitters, System-on-Chips, RF front end and ZigBee processors.
HDI Layer Stackups for Large Dense PCBs
Mentor Graphics
This paper discusses the various HDI technologies and the best approaches for successfully taking advantage of this technology.
The Top 10 Issues that Cause Bad Prototypes
Screaming Circuits
Engineering teams are constantly challenged to speed product development with fewer internal resources. Engineers are called upon to fix issues driven by compressed product development cycles. Read this "Top Ten" checklist of issues they see on a regular basis.
Improving battery safety, charging, and fuel gauging in portable media applications
Jinrong Qian • Texas Instruments
This technical paper focuses on three very important parts of portable-power design: system safety, Li-Ion battery charging, and fuel gauge accuracy.
Environmental Friendly Protection of Automotive Electronics
Kent Larson • Dow Corning Electronics
Famous golfers are not the only ones who can wear a prized green coat. How about your automotive electronics? Are they wearing green?
Effective Stackup Design for High-speed Interfaces
Mentor Graphics
Proper stackup design is important because it forms the basis of a successful printed circuit board (PCB) design. Newer ICs today have edge rates in the sub-nanosecond range; the fastest of which are multi-gigabit transceivers that have edge rates of less than 100ps.
Dow Corning material and application center prove key to prototyping of automotive starter/alternator design
Dow Corning Electronics
Auto manufacturers and suppliers are pulling out all the stops to find creative ways to boost gas mileage and reduce emissions, and Dow Corning technology is playing a part in many ways.
Low Power Intel Architecture Platform for In-vehicle Infotainment
Suresh Marisetty et al • Intel
This article presents the architecture of this platform for the IVI market segment powered by the Intel Atom processor family of low power embedded processors and standards-based platform hardware and software ecosystem.
 HIDDEN GEMS Introducing the Xilinx Targeted Design Platform: Fulfilling the Programmable Imperative
Tim Erjavec • Xilinx

Voltage Reference Vastly Reduces Energy Consumption over Typical Solution
Maxim Integrated Products

Interoperability Comes to EDA Tools
Tanner EDA

Go Beyond Compliance for Profitability and Environmental Sustainability
ENOVIA, a Dassault Systèmes Brand

Reducing Physical Verification Cycle Time
John Ferguson • Mentor Graphics

 WHAT'S HOT CAN Primer: Creating your own Network
Robert Boys • Keil, an ARM Company

JTAG Debug—Everything You Need to Know
Mentor Graphics

Fundamentals of Signal Integrity
Tektronix

Choosing between pipeline vs. sigma delta ADCs for communications applications
Noel O'Riordan • Silicon & Software Systems

High-Definition Surveillance Systems Using Low Cost FPGAs
Suhel Dhanani • Altera


Demystifying DO-254
Tom Dewey • Mentor Graphics

Ways to Use USB in Embedded Systems
Yingbo Hu and Ralph Moore • Micro Digital

Coordinated Circuit Protection Helps Manufacturers Meet Requirements of GR-1089-CORE, Issue 4
Tyco Electronics

Advanced Dynamic Power Reduction Techniques: Operand Isolation, Operand Pre-computation, and Multi-VDD
Kajin Shi and Neel Desai • Synopsys

Measuring the Performance of Equalized Serial Data Links Across the Design Flow
Steven McKinney et al • Mentor Graphics and Tektronix

Overcoming LTE PHY Design Challenges Using ESL Design Methodologies
Louie Valeña • CoWare

Establishing Confidence in PDN Simulation
Eric Bogatin • Bogatin Enterprises

Nucleus Platform Solutions
Mentor Graphics

DO-254 Compliance: Reducing Project Cost by Avoiding Common Pitfalls
Tammy Reeve and Michelle Lange • Mentor Graphics

Solving FM Antenna Design Challenges in Portable Devices
Natalian Zhai • Silicon Laboratories

Wind River High-Assurance Solutions for Aerospace and Defense
Wind River

The PSP Model in RF CMOS Design
Fujitsu Microelectronics

An Evolution of Gate and Via Parasitic Resistance Extraction
Jarrod Stykes • Cypress Semiconductor

Migrating Legacy RTOS Device Drivers to Embedded Linux
Bill Weinberg • MontaVista Software

MSP430 Ultra-Low-Power Microcontrollers
Texas Instruments

Raising the RTL Abstraction Level and Design Conciseness with SystemVerilog
Sachin Kakkar et al • Mentor Graphics

Isolated Supply Overview and Design Trade-Offs
David Baba • National Semiconductor

Simplifying BLDC Commutation and Feedback System
Teng and Kong Leong • Avago Technologies

Power Integrity Effects of High Density
Happy Holden and Patrick Carrier • Mentor Graphics

Introduction to Secure Processing
CPU Tech

50 V RF LDMOS: An Ideal RF Power Technology for ISM, Broadcast and Radar Applications
Pierre Piel et al • Freescale Semiconductor

Power Management in an Embedded Multiprocessor Cluster
Matthias Knoth • MIPS Technologies

Xilinx Virtex-5 (UMC 65nm Process) FPGA (XC5VLX50)
Semiconductor Insights

HDI Layer Stackups for Large Dense PCBs
Mentor Graphics

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