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WP192 - SMT Package Rework
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Xilinx Surface Mount Technology (SMT) packages include the leaded family packages (Quad Flat Pack (QFP) and Plastic Leaded Chip Carrier (PLCC)) and the Ball Grid Array (BGA) packages. SMT rework can be necessary for any of the following reasons: assembly related defects, such as shorts, opens, wrong orientation, and solder ball defects; device/package related defects/failure analysis; and engineering change or system upgrade.
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FPGA Central is a website bringing the FPGA (Field Programable Gate Array), CPLD , PLD, VLSI community together at one central location. Some Keywords: FGPA, FPGA, EDA Tools, FPGA Design, Central, Programmable logic, LUT, VLSI, SoC, Journal
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