HW-V2P-ML325

The ML325 platform allows designers to investigate and experiment with the features of the Virtex-II Pro XC2VP70 Rocket I/O Multi Gigabit Transceivers. The ML325 is an official platform for full and detailed characterization of the high speed IO channels. This board is also ideal for demonstration of eye diagrams at different data rates (622 Mbps to 3.125 Gbps), pre emphasis levels (from10% to 33%) and TX differential voltage swings (400mV to 800mV)..

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An ideal platform for characterization of the Virtex-II Pro XC2VP70 RocketIO Multi Gigabit Transceivers

Xilinx On Board Information

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Xilinx Education Services

Conversion Module, SMA To SFP

Conversion Module, SMA to SATA

Conversion Module, SMA to HSSDC2

Conversion Module, SMA to RJ45

Virtex-II Pro ML324 and ML325 Platform User Guide (PDF)

RocketIO User Guide (PDF)

Device Family Support

Virtex-II Pro

Key Features

Xilinx Devices: XC2VP70-FF1704, XCCACE (System ACE CF)

Two differential oscillators (156.25 MHz), Four pairs of 50 Ohm SMA connectors for external clock, Two Single-Ended SMA Clocks, Two crystal oscillator sockets (FPGA clock)

CompactFlash Card

RS232, BERT Headers, Conversion modules for RJ45, SATA, SFP, and HSSDC2

Targeted Application

Markets: Telecom/Datacom, Storage, Servers

Applications: High-speed Serial I/O, Serial Interface, Serial/Deserialization

This Product Includes:

Characterization Board, 4 SMA to SMA Cable, 16MB Compactflash Card, Power Supply, Serial Cable, Documentation CD

For additional information contact: [email protected]
Xilinx offers a 90-day limited warranty on this product. See Limited Warranty for detail information.