BGA Testing

I'm writing to introduce my company's proprietary 3 tiered BGA testing service. We have developed the most comprehensive BGA test on the market to allow CM's/OEM's to source BGA packaged PLD's from the open market with no risk of substandard components entering the manufacturing environment. Open market sourcing allows for major cost savings opportunities, the use of older date code products for legacy builds or as an alternative to redesign. Open market sourcing can also solve lead time/allocation/shortage issues. Our test also allows our customers to confidently use reclaimed/reballed BGA's without fear of failure.

Our 3 tiered approach addresses the most common issues associated with BGA failures which are I/O opens and shorts as well as moisture penetration. We begin with a visual inspection (similar tot IDEA Std. 1010-A). The next step is Power up-VCC Spec voltage for opens/shorts and current drain. The next step is electrical pinout function, I/O Map and logic states per BSDL file along with Die ID Code (X-ray). We also offer a variety of A la Carte testing options to complement the standard service.

In addition to providing test services, we have also built an extensive inventory of pretested BGA's (primarily but not limited to Xilinx, Altera and Freescale). The pretested components are typically priced considerably less than franchise standard pricing.

Please contact me to discuss or test services or to check our inventory of prestested parts. SAM

Sam Dwyer ([email protected])
Business Development Manager
MPIRedX
ph:781.592.4600
www.mpiredx.com