Two days of highly technical sessions will include inovative papers on:
- Silicon and Software IP design and packaging
- Platform level IP (Asic, Structured ASIC, FPGA)
- IP/SoC qualification, emulation and prototyping
- ESL, Transaction level modelling for IP based SoC design - Reuse practice, Reuse standards and design for reuse
- Collaborative IP Based platform
- Reuse in Electronic subsystem, system
- Business model
- Security, IP protection, patent
SUBMISSION PROCEDURE
A summary of 3 pages is recommended
Please indicate if you wish to compete for the best IP 07 prize.
You can submit an electronic version of your summary in a Word, PDF or PostScript format using one of the following methods:
1. By using the Online Submission Form ## RECOMMENDED ##
2. By sending an e-mail containing the paper title, your names, the name of the contact author, postal and e-mail address, telephone and fax number, as specified in the online submission form to ip07@design-reuse.com
All the correspondence with authors will be handled by e-mail.
Outstanding papers submitted or accepted in other conferences will also be considered in this workshop. Please specify it in your submission.
IMPORTANT DATES
Deadline for submission of the extended abstract
Notification of acceptance
Final Version of the manuscript
Working Conference September 30, 2007
October 23, 2007
November 13, 2007
December 5-6, 2007